• Responsible for leading end-to-end memory quality
• Coordinate memory component FA(Failure Analysis) activities including RA(Root-cause Analysis), CA(Corrective Action), CIP(Continuous improvement plan) to improve the quality of memory products.
• Work closely with memory suppliers and internal teams to assure new memory product readiness and ensure performance meets the key quality and reliability metrics.
• Collaborate with engineering organizations to resolve memory failures.
• Lead PCN(Product Change Notification) and provide risk assessments for proposed changes and represent supplier’s change in the CRB(Change Control Board) meetings
• Lead quality audits at supplier site to ensure supplier quality practice

• MS/BS in engineering or equivalent experience
• 8+ years significant experience in memory industry
• Knowledge of DRAM operation and understanding key AC/DC parameters in datasheet
• Strong understanding of memory wafer fab process, package assembly process, testing, and firmware.
• In-depth knowledge of memory quality and reliability concept including qualification report and JEDEC reliability standard
• Familiar with physical FA technique such as C-SAM, SEM, TEM, FTIR, ASE, Hot Spot Analysis
• Supplier quality management experience and a deep understanding of problem-solving tools including 8D principle and statistical process control principles
• Experience with data analysis using Excel, Minitab, or JMP
• Dedicated and able to work with minimum supervision
• Proficient English (both written and spoken) and excellent communication skills.

• Direct working experience with major memory suppliers
• Extensive knowledge and hand-on experience on HBM and LPDDR quality improvement and failure analysis
• Comprehensive knowledge of Co Wo S process