India Job Openings

HCL Technologies

Technical Lead

Bengaluru

September 15, 2024

Technical Lead

Bangalore

INDIA

Job Family

Architecture / Design

Job Description (Posting).

Signal - Power Integrity Package and board experience is mandatory Minimum 5 to 8 years experience Package SI engineer.Strong Signal Integrity fundamentals Hands on experience in PCB and Package modelling. Experience in simulating (FDTD) memory interfaces for Board and Package is required (DDR3DDR4, LPDDR3/4)Experience in simulating (FD/TD) High Speed Serial IO interfaces for Board and Package is required (PCIe Gen3/4, RGMII...etc) Intel design experience preferred Good knowledge of Power Delivery Network, impedance profile analysis, IR Drop Analysis, modelling of PCB and Package Shapes and time domain Analysis.Should be able to provide practical solutions to PCB/Package design team based on simulation results and analysis.Strong knowledge in simulation tools Specifically Readhawk and other tools Ansys SIwave, HFSS, Hspice, Sigrity(2.5D and 3D-EM Must) and ADS. (1.) To leverage design expertise to ensure that software and products exhibit user-friendliness, intuitiveness, and alignment with user expectations, contributing to the creation of seamless user experiences. (2.) To lead a team of designers, provide guidance, and ensuring the delivery of high-quality design solutions in alignment with the overall business goals. (3.) To present design concepts and play a crucial role in shaping the overall design vision and strategy. (4.) To stay abreast of industry trends, emerging technologies to drive innovation and excellence in design.

No. of Positions

Skill (Primary)

Technical Skills (ERS)-HW PCB Advanced-High Speed PCB design practices

Auto req ID

1457392BR

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