Singapore Job Openings
Hewlett Packard
College Intern - R&D Mechanical Hardware Engineering (Simulation)
Bukit Merah Estate
September 2, 2024
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Develop portions of Finite Element Analysis (FEA) model of mechanical and thermal hardware, conduct simulation of product level tests and analyze results to provide insights to other mechanical hardware engineers and internal and outsourced development partners on next phase mechanical design and development.
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Designs portions of engineering solutions for mechanical and thermal hardware, electronics enclosures, and production tooling based on established engineering principles and in accordance with provided specifications and requirements.
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Implements established test plans for existing designs, including validation of tolerances, form/fit/function, shock and vibration, electromagnetic interference, safety, reliability, developing fan curves, system power measurements & acoustics.
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Develops understanding and build relationship with internal and outsourced development partners on mechanical design and development.
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Participates as a member of project team of other mechanical hardware engineers and internal and outsourced development partners to develop reliable, cost effective and high quality solutions for low to moderately- complex products.
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Currently studying a Bachelor's or Master's in Mechanical Engineering or similar fields.
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Available for a 5-6 months internship, starting in Jan 2025.
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Experience or understanding of Co Create Creo Elements Direct Modelling/Pro Engineer or other 3D CAD software as a mechanical design tool.
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Experience or understanding of Altair Hyperworks, ANSYS or other 3D Finite Element Analysis (FEA) modelling software is highly preferable.
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Good analytical and problem solving skills.
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Understanding of design for sheet metal and plastic parts and associated production tooling and processes.
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Understanding of mechanical and thermal properties of materials.
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