Singapore Job Openings
National University of Singapore
Research Fellow (Thermal Management of Flexible Electronics)
Singapore
FULL TIME
November 5, 2024
Location: COLLEGE OF DESIGN & ENG, Kent Ridge Campus, SG
Company: National University of Singapore
Job Description
- Design and fabricate integrated thermal management system for flexible electronics devices, including RF devices.
- Conduct thermal simulations to identify potential thermal issues and optimize the heat dissipation capabilities of the devices.
- Develop and implement innovative thermal management materials, structures, and approaches to address overheating challenges in flexible electronics.
- Explore and evaluate new materials for efficient heat transfer, storage, and dissipation in flexible electronic devices.
- Collaborate with interdisciplinary team members to integrate thermal management solutions into the overall device design and fabrication process.
- Perform experimental characterization of thermal properties and performance of flexible electronic devices using appropriate measurement techniques and equipment, including IR thermal imaging and thermal reflectance system.
We offer a competitive salary commensurate with qualifications and experience, along with a stimulating research environment and access to state-of-the-art facilities. This is a full-time position with an initial contract duration of 12 months, with potential for renewal based on performance and funding availability.
To apply, please submit your application materials, including a cover letter and curriculum vitae to zamburg@nus.edu.sg
Review of applications will begin immediately and continue until the position is filled.
Qualifications
- Ph D Degree in Electrical Engineering, Chemistry, Materials Science, or a related field with a focus on flexible electronics and thermal management.
- Strong background in thermal management of electronic devices.
- Proficiency in thermal simulation software for analyzing and optimizing thermal performance.
- Knowledge of thermal management techniques and strategies for flexible electronics, including heat dissipation mechanisms and materials.
- Experience in developing and characterizing novel materials for heat transfer, storage, and dissipation in electronic devices.
- Familiarity with experimental techniques for thermal characterization, such as thermal imaging and thermal reflectance.
- Strong problem-solving skills and ability to think critically about thermal management challenges in flexible electronics.
- Excellent written and verbal communication skills, with the ability to present research findings effectively.
- Track record of research publications in reputable scientific journals.
- Open to Fixed Term Contract.
More Information
Organization: College of Design and Engineering
Department : Electrical and Computer Engineering
Employee Referral Eligible: No
Job requisition ID : 26890
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