Taiwan Job Openings
Lenovo
Advisory Mechanical Engineer
October 31, 2024
General Information
Req #
WD00074002
Career area:
Hardware Engineering
Country/Region:
Taiwan
State:
Taipei City
City:
中山（Zhongshan）
Date:
Thursday, October 31, 2024
Working time:
Full-time
Additional Locations:
- Taiwan - Taipei City
Why Work at Lenovo
We are Lenovo. We do what we say. We own what we do. We WOW our customers.
Lenovo is a US$57 billion revenue global technology powerhouse, ranked #248 in the Fortune Global 500, and serving millions of customers every day in 180 markets. Focused on a bold vision to deliver Smarter Technology for All, Lenovo has built on its success as the world’s largest PC company with a full-stack portfolio of AI-enabled, AI-ready, and AI-optimized devices (PCs, workstations, smartphones, tablets), infrastructure (server, storage, edge, high performance computing and software defined infrastructure), software, solutions, and services. Lenovo’s continued investment in world-changing innovation is building a more equitable, trustworthy, and smarter future for everyone, everywhere. Lenovo is listed on the Hong Kong stock exchange under Lenovo Group Limited (HKSE: 992) (ADR: LNVGY).
This transformation together with Lenovo’s world-changing innovation is building a more inclusive, trustworthy, and smarter future for everyone, everywhere. To find out more visit www.lenovo.com, and read about the latest news via our Story Hub.
Description and Requirements
- About Organization
- Yokohama development team is leading development of Think Pad products. The department of this open recruitment is taking charge of mechanical design for system integration and cooling mainly.
- Roles and responsibilities
- Lead mechanical design for PC system overall, integration and cooling.
- Handle product execution work
- Collaboration with ME/ID/EE team for system integrated thermal design
- Develop thermal design to achieve good cooling performance and UX (Skin temperature, FAN noise).
- Mechanical design for thermal parts by 3D CAD
- FAN, Heatsink, Heat pipe, Vapor chamber, Graphite sheet
- Mockup creation / evaluation
- Ensure cooling capability for TDP requirement
- Overseas Thermal supplier management for design and quality
- Communication with ODM team
- End-to-end development
- Key Interaction with:
- Think Pad development team (ID/ME/EE)
- Think Pad NPI (New product introduction) team
- Think Pad GCM (Global commodity management) team
- Think Pad SQE (Suppler quality engineering) team
- Think Pad PA (Product assurance) team
- Thermal team of Lenovo group (USA, Japan, Taiwan, China)
- So C vendor
- Cooling device parts supplier
Additional Locations:
- Taiwan - Taipei City
- Taiwan
- Taiwan - Taipei City
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