Taiwan Job Openings
TSMC
IC Design Engineer
FULL TIME
August 30, 2024
公司名稱
台灣積體電路製造股份有限公司
工作地點
台灣
專業領域
IC 設計技術
職別
工程師/管理師
職務類型
正職
職務張貼日
2024/08/30
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。身為全球的企業公民，台積公司的營運範圍遍及亞洲、歐洲及北美，致力成為企業社會責任的行動者。2023年，台積公司提供最廣泛的先進製程、特殊製程及先進封裝等288種製程技術，為528個客戶生產1萬1,895種不同產品。台積公司企業總部位於台灣新竹。
進一步資訊請至台積公司網站 https://www.tsmc.com.tw 查詢。
進一步資訊請至台積公司網站 https://www.tsmc.com.tw 查詢。
Design and Technology Platform (DTP)提供差異化和世界領先的設計解決方案，以實現領先的AI/HPC、移動、汽車和物聯網應用的So C在台積電多樣化的矽和封裝技術平台上的實施。我們與全球領先的So C設計團隊和生態系統領域專家合作，推動行業領先的製程設計套件（PDK）、矽驗證的可重用設計塊（IP），包括標準單元庫、嵌入式存儲器、通用I/O、模擬和接口IP，以及單片So C和異構3DIC的電子設計自動化工具（EDA）和設計流程，加速將創新轉化為矽片的過程，推動日常生活中的變革！
Design and Technology Platform (DTP) provides differentiated and world-leading design solutions to enable the implementation of System on Chip (So C) for leading AI/HPC, communication, automotive and Io T applications on TSMC's diverse silicon and packaging technology platform. We work with the world's leading So C design teams and ecosystem experts to promote industry-leading process design kits (PDKs) and reusable design blocks for the semiconductor intellectual property core (IP), including standard cell libraries, embedded memory, general-purpose input/output (GPIO), simulation and interface IP, as well as electronic design automation (EDA) tools and design flows for monolithic So Cs and heterogeneous 3DICs. This allows us to accelerate the process of transforming innovation into silicon chips and creating revolutionary changes in daily life!
職務說明
1. Physical Design Engineer (Taiwan)
2024 熱門職缺/2024 Popular Job Positions:
1. Physical Design Engineer (Taiwan)
2. APR Engineer
3. System and Chip Design Solutions Engineer
4. Digital Design and Automation Engineer
5. 3DIC flow Engineer
職務要求
1. Passionate about the development of world-leading technologies.
多元、公平與共榮呼應台積公司的核心價值和經營理念，對公司未來的成功至關重要。台積公司對多元、公平與共融的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。台積公司致力營造公平且無障礙的職場環境，對不同特質與需求的身心障礙同仁提供所需的資源。我們承諾促進共融文化，讓每位員工都感到被重視，且有能力為我們的企業使命做出貢獻，並為全球客戶提供卓越服務。
1. 對開發世界領先的技術充滿熱情。
2. 工程或科學領域的碩士(含)以上學位，例如材料科學工程、電機工程、化學工程、機械工程、物理、化學或光學相關。
3. 對IC製程設備、流程整合、化學及物理具有扎實的技術底蘊。
4. 良好和開放的溝通技巧，能夠在跨組織團隊中工作，包括內部和外部合作夥伴。
5. 流利英語能力。
6. 具AI及程式設計相關技能者為優先考量。
7. 對統計製程管制（SPC）和/或實驗設計（DOE）原則有深入瞭解。具備機器學習或人工智慧相關知識者為加分優勢。
8. 能夠靈活地應變優先事項與工作職責，以協助組織單位需求。
9. 積極參與製程或設備工作並具有強烈的責任感。
10. 願意頻繁地進入Fab。
11. 需要具備基於基礎模型（而非經驗模型）的技術端問題解決和分析能力。
12. 需要具備優秀的書寫和口語溝通能力。
1. Passionate about the development of world-leading technologies.
2. Master's degree or above in an engineering or scientific field such as Materials Science Engineering, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics, Chemistry or Optics.
3. Solid technical understanding of IC processing equipment, integrated flow, chemistry, and physics.
4. Exhibit good and open communication skills and be able to work within cross-functional teams, including internal and external partners.
5. Fluent in English.
6. Skills in AI and programming are preferred.
7. Strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles. Having knowledge of machine learning or artificial intelligence is an added advantage.
8. Flexibility in changing priorities and responsibilities to support business needs.
9. Hands-on participation on process or hardware and a strong sense of ownership.
10. Willing to make frequent fab presence.
11. Strong technical problem-solving and analytical skills, based upon fundamental, rather than empirical models is required.
12. Excellent written and spoken communication skills are required.
多元、公平與共榮呼應台積公司的核心價值和經營理念，對公司未來的成功至關重要。台積公司對多元、公平與共融的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。台積公司致力營造公平且無障礙的職場環境，對不同特質與需求的身心障礙同仁提供所需的資源。我們承諾促進共融文化，讓每位員工都感到被重視，且有能力為我們的企業使命做出貢獻，並為全球客戶提供卓越服務。
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