• Leading development of cutting-edge microelectronics packaging of Nvidia Networking Business Unit’s future products, evaluating NVIDIA products for reliability and performance.
• Review manufacturability readiness at each milestone.
• Work with world leading vendors to develop highly challenging packaging solutions.
• Join and lead task forces to investigate and support production excursions, failure analysis and reliability issues and establish quality standards.
• Monitor substrate and assembly production KPIs and collaborate with cross functional teams to define and monitor Yield Improvement Plans for continuous improvement and establish quality standards.
• Lead process changes reviews, prepare and present data in Change Control Board meetings, lead technical reviews of product changes throughout the supply chain.

• Mechanical/Material Engineering degree, or any related equivalent experience.
• 5+ years of relevant work experience in the semiconductor packaging industry, substrate manufacturing site or assembly site.
• Basic design skills, such as using 2D Artios CAD, and 3D NX/Solid Works/Creo applications.
• Experience in DFM, understand tooling design, manufacturing processes, material properties and metrology tools.
• High awareness for quality, robustness, and manufacturability.
• High self-learning and self-motivation skills, fostering a culture of continuous learning, ongoing process improvement and proactive approach.
• Leadership skills, capability to lead cross company projects that involve cross functional teams in different locations.
• Curious and creative problem solver, well organized and multi-tasker.
• Good English, verbal and written communication skills.

• Experience with mechanical CAD software (Solidworks, Spaceclaim).
• Experience with development of mechanical FEA simulations using Ansys software.
• Experience managing multiple packaging projects in cross-functional settings.
• NPI processes leadership, including working with operations on manufacturing and quality.