1. Lead new technology transfers, production line set up / maintenance, team establishment, quality / productivity improvement to ensure the whole production process smoothly.
2. Elevate Engineering and Manufacturing excellence in PVD/DIF/CVD/CMP/LIT/ETCH (either one) fiel

1. Module process / equipment fundamental improvement.
2. Innovate and seize opportunities for wafer quality / productivity improvement.
3. Work with Process integration / Manufacturing / Yield improvement / Cross module team to sustain high quality wafer production / delivery.
4. Proactively identify talent and continuously develop team members with a deliberate roadmap.

職種：ハード系設計

【応募資格・条件】

1. Minimum of a Bachler degree in an engineering and scientific field such as Materials Science, Electrical Engineering, Chemical Engineering and Mechanical Engineering, or equivalent work experiences and background.
2. Minimum 8 years of experience in the semiconductor field, especially in module process development, or equivalent work experiences and background.
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【給与】

年俸10,000,000円～20,000,000円
※経験や能力を考慮して決定致します。

【待遇・福利厚生】

厚生年金、健康保険、雇用保険、労災保険、他個人年金プラン、退職金制度、住宅手当・転居費用サポート（当社規定による）
通勤手当:実費相当額（上限50,000円/月）
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【勤務地】

熊本県菊池郡
熊本県菊池郡菊陽町大字原水4106番地1

【勤務曜日】

土日祝休
［休日休暇］完全週休2日制

【勤務時間】

8:30～17:30
実働時間：8時間/日