Design Engineering Intern

Experience Level: Internship

Job Type: Intern

Location:Japan - Osaka, JP

Requisition ID: 8410

Design Engineering Intern

Qorvo is All Around You! We manufacture innovative RF solutions at the center of connectivity to enable high-performance applications for advanced wireless devices, wired and wireless networks and defense radar and communications for 5G networks, cloud computing, the Internet of Things, and other emerging applications. We are a global company thriving on a culture of innovation, diversity, and inclusion. Our people are always at the core of Qorvo’s innovation. Qorvo is a place to stretch your imagination and push boundaries to achieve success. Learn more about Top 10 Reasons to make a career at Qorvo.

Qorvo’s Internship Program is designed for college students currently enrolled in an accredited Bachelor’s, Master’s, or Ph D program. Qorvo offers real work experience, exposure to upper management, and the opportunity to pursue full time opportunities, as available.

Qorvo’s Internship Program offers:

• Challenging, skill-building assignments
• Mentoring and coaching from industry experts
• Lunch & Learns and other learning opportunities
• Collaborative team-based work environment
• Networking and social events
• Final presentation to business leaders

Qorvo’s Design Engineering Internships are offered in our High Performance Analog, Advanced Cellular, and Connectivity and Sensors business groups. Specific projects and responsibilities will be determined based on the business needs at the time of the internship assignment.

Responsibilities:

• Producing and implementing designs to meet customer specifications for:
• Low cost and thermally efficient package platforms
• LTE, carrier aggregation, multiple antennas, filters, and power management
• Ruggedness, ESD, and quality
• Meeting performance requirements while also considering size, cost, footprint, and schedule
• Working with signal generators, spectrum analyzers, network analyzers, and power meters to compare simulated data to real lab data
• Partnering with technicians to perform circuit simulations and testing as needed
• Designing, testing, and tuning of RF PAs
• Developing and executing test plans for electronics package mechanical robustness
• Developing application guidelines for package assembly into next level assembly
• Creating basic algorithms for automating FEA model generation
• Potential to work with:
• Signal generators, spectrum analyzers, network analyzers, and power meters to compare simulated data to real lab data
• Transistor level circuit design, simulation, and layout
• Analog and RF measurement

Qualifications:

• Currently pursuing a BS, MS, Ph D in Electrical or Mechanical Engineering
• Minimum 3.0 GPA
• RF circuit design course work and/or experience strongly preferred
• Exposure to RF measurement equipment such as, spectrum analyzers and network analyzers preferred
• Proficiency with Microsoft Office (Excel, Word, Power Point)
• Software Exposure: ADS, FEM, HFSS, Momentum, Cadence, Dynamic Link, 3D CAD, Mechanical FEA
• Self-Starter with strong written and verbal communication skills
• Effective organization skills for systematic planning and scheduling
• Detail oriented to ensure design and delivery of high yielding products

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