LIGENTEC is a young, dynamic and strongly growing company, headquartered in Lausanne, Switzerland, near EPFL, close to the shore of Lake Geneva. We are developing Photonic Integrated Circuits (PICs) to world-leading performance with our customers for applications in Quantum Technologies, Li DAR, Space, Biosensors and more.

To support our growth, we are looking for a:
Process Engineer
Heterogeneous Integration

Tasks

Within LIGENTEC’s engineering team, our mission is to bring our integrated photonics platform to the next level, building on its world-class passive photonics and extending the functionality with active component integration.

Role and Responsibilities

You are part of an interdisciplinary project team that integrates active functionalities such as modulators, photodiodes and amplifiers onto LIGENTEC’s state-of-the art passives platform.

• Develop new processes for new electro-optic modulators, including thin-film lithium niobate integration or other materials on Si N. To this end, you:
• Define and execute Design of Experiments at the clean-room facilities.
• Contribute to the project technology roadmap from a process development perspective.
• Stay up to date with state-of-the art process technology development on active components.
• Increase the maturity level of developed processes in order to release them for early customer engagements. To this end, you:
• Implement statistical process control and physical model fitting of opto-electrical device properties.
• Execute fabrication runs for photonic integrated circuits for internal and external customers.
• Documentation of results with strong emphasis on correlations between optical and electrical properties of integrated actives.
• Contribute to the R&D and Process teams in all aspects, especially process integration topics.

Requirements

• Master’s degree in electrical, chemical, physical or nano engineering.
• Min of 3 years experience in relevant environments (MEMS, Semiconductors, Nano-Optics) with hands-on experience on clean room processes such as wafer bonding, lithography, etching, metallization, different material deposition and characterisation techniques.
• Experience with heterogeneous integration techniques like wafer bonding, micro-transfer printing or flip-chip assembly is a plus.
• Understanding of photonic devices like modulators, photodiodes and lasers is a plus.
• Knowledge of python for statistical data analysis is a plus.
• Excellent technical problem-solving skills
• Open minded, critical, and innovative.
• Ability to work independently and with remote teams.
• Working proficiency in English.

Benefits

• A flexible and dynamic start-up work environment.
• Be a member of an international, diverse, customer-focused and highly motivated team.
• Personal responsibility in your job and the chance to grow with us
• Our passion to bring PICs to everyday life.

We look forward to receiving your full application, including 1) your CV, 2) a statement of interest (relating the position to your skills) and 3) grade or work certificates. Non-complete applications may not be considered.