About Tower Semiconductor

Job Description

Essential Duties and Responsibilities

• Sustaining and improving dry etch processes in a high volume manufacturing environment.
• Monitoring and controlling dry etch processes.
• Developing and implementing new dry etch capabilities and process enhancements to improve key performance metrics such as yield, throughput, and cycle time.
• Ramping new process technologies from R&D to volume manufacturing.
• Characterizing and qualifying new equipment, equipment upgrades, chemicals, and process technologies
• Troubleshooting and solving yield issues.
• Supporting process and technology transfers between global manufacturing sites.
• Leading taskforces as needed and helping develop solutions that prevent recurrence.
• Interfacing with global counterparts to benchmark and improve dry etch processes and procedures company-wide
• Using FMEAs, lean manufacturing, six sigma, and 8D problem solving processes.

Required Qualifications

• Either B.S. Degree in Chemistry, Chemical Engineering, Materials Science, Solid State Physics, Electrical Engineering, or other relevant engineering physical science discipline is required.
• Demonstrated knowledge of dry etch principles, theories, concepts, and techniques.
• Ability to use knowledge to provide solutions to a variety of difficult problems.
• Strong organizational skills; demonstrated ability to manage multiple tasks simultaneously and to react to shifting priorities to meet business needs.
• Demonstrated experience monitoring and sustaining dry etch processes in a production environment.
• Demonstrated experience dispositioning production lots during and after dry etch process steps per out-of-control plans.
• Demonstrated experience using statistics (e.g. probability plots, t-test) to analyze wafer/lot test results from various tools and/or with various process conditions to check for differences in populations.
• Demonstrated experience with statistical design of experiment (DOE) in optimizing a process recipe
• Demonstrated ability to meet deadlines and commitments.
• Excellent interpersonal skills, energetic and self-starter.
• Outstanding communication skills - both written and verbal.
• Demonstrated ability to work well within a team.

Preferred Qualifications

• Prefer minimum 5 years of dry etch process engineering experience with B.S. Degree or 3 years of experience with an advanced degree.
• Demonstrated expertise with TEL Unity, AMAT DPS, MXP and/or LAM2300, 9400, 9600 etch tools and processes.
• Knowledge of device physics.
• Knowledge of PROMIS wip management software and JMP Statistical analysis software.
• Six sigma certification

Work Environment

Compensation Range