Req #

WD00071739

Career area:

Hardware Engineering

Country/Region:

China

State:

Guangdong

City:

深圳（Shenzhen）

Date:

Wednesday, September 18, 2024

Working time:

Full-time

Additional Locations:

• China - Guangdong - 深圳（Shenzhen）

Position Description:
The Senior component engineer is responsible to work with Lenovo internal team and direct subcon (foundry, bump, assembly and test house) to drive cooperate technology and quality requirement; provide leadership and strategies and giving Lenovo the best procured IC solutions. These activities include the following:
Quality and Technology related:
1. Generate Lenovo quality requirement for fab, bump, assembly and testing process.
2. Supplier and technology qualification, including fab, bumping, assembly and testing etc.
3. Quality issue handling during NPI and mass product phase, including driving root cause analysis, corrective action, affective range, risk assessment, etc. and work with RD, CQE team and supplier for end to end closure for quality issue.
4. Component supplier management including regular supplier performance monitor, factory audit, PCN/EOL management, continuous improvement etc.
Commercial Related
1.Driving preferred suppliers and technologies, as well as introducing new suppliers and technologies to ensure Lenovo products competitiveness in the market for cost, supply, technology and quality
2. Working with GCM, RD and participating supplier and technology sourcing strategies
3. Working with GCM and cross function team to do RFQ to evaluation supplier quality performance, capability etc.
4. Regular supplier performance evaluation
Design Related
1. Set up design quality requirement in design phase such as design input/output, verification item, DFx, DFMEA, reliability criteria etc.
2. Follow/monitor quality procedure will be executed in development phase.
3. Working with Lenovo and subcon to ensure new product will be fully realized during NPI and mass production.
Position Requirements:
1. Bachelor degree or above in Electronic Engineering
2. 10+ years of engineering experience in semiconductor fab and assembly area.
3. Familiar with advanced foundry and assembly technologies and manufacture process Knowledge about IC manufacture supply chain and their capability such as key foundry, as well as subcon for bumping, assembly/testing etc.
4. Comprehensive knowledge about ISO9000 quality system and other ISO standard such as ISO14001 etc.
5. Strong quality statistical tools background such as FMEA, SPC etc.
6.Strong factory audit skill and familiar with quality system, IEC, JEDEC standard etc.
7. Good communication skill (Oral and written) for both English and China

Additional Locations:

• China - Guangdong - 深圳（Shenzhen）