Internship -Failure Analysis Engineer

Inven Sense, a TDK Group company, is a world leading provider of MEMS sensor platforms found in Mobile, Wearables, Smart Home,Industrial, and Automotive products. The company’s patented Fabrication Platform, Motion Fusion® technology, audio solutions, andlocation software and services address the emerging need of manymass-market consumer applications via improved performance,accuracy, and intuitive motion, gesture, and sound-based interfaces.In May of 2017, Inven Sense became part of the MEMS Sensors Business Group within the newly formed Sensor Systems Business Company of TDK Corporation.

Job summary:
Would you like to be a Doctor of IC? We will provide the practical experience to you, guide you to perform “surgery” toward the IC step by step. You will learn how to dig out the defective source and how to fix it.
At TDK-Invensense Taiwan we built one professional Failure Analysis Fab for MEMS (Micro Electro Mechanical Systems) as well as ASIC. We are looking for talent of an IC Doctor. If you would like to join us, please apply!
Responsibilities include:
Conduct functional test/bench test of failure IC and analyze failure mode according to all available data.
Perform physical failure analysis toward the failure IC, including optical microscope inspection, IROM, SEM/EDX, 3D profiler, SEM cross-section, FIB, SAT, micro-probing and hotspot analysis (EMMI/In Ga As/OBIRCH) …etc.
Collaborate with junior engineers and cross-functional teams to understand sensor failure mechanism.
Review/analyze FA data and failure mechanism then summarize into English FA report in the format of word and powerpoint.
Skill and qualification:
Required:
Graduate or undergraduate school student.
Verbal and written communication skills in English.
Knowledge and experience in at least three of the following techniques - optical microscope, IROM, SEM/EDX, 3D profiler, SEM cross-section, FIB, SAT, micro-probing and hotspot analysis (EMMI/In Ga As/OBIRCH).

Preferred:
Academic background in Electrical/Mechanical Engineering, Chemistry/Material Engineering, Physics or related field.
Fundamental understanding of MEMS, CMOS design/technology or semiconductor manufacturing.
Statistical data analysis tools such as JMP.
Experience in 8D report writing.